全球半导体销售额达到 $99.5 Billion in March. The Semiconductor Industry Association (SIA) announced global semiconductor sales reached $99.5 billion in March 2026, an 11.5% increase from February 2026 ($89.2 billion) and a 79.2% increase from March 2025 ($55.5 billion). This marks the 13th consecutive month of growth, driven by surging AI cloud computing demand for memory, logic chips, and advanced packaging materials. Q1 2026 total sales hit $298.5 billion, up 25% from Q4 2025.
台积电2nm及5/4nm产能2026年全年吃紧
TSMC’s 2nm capacity was fully booked for 2026 by orders from global tech giants, with orders reportedly booked until 2028. TSMC raised 2026 capital expenditure guidance to $52–56 billion, with 70–80% allocated to 2nm/1.4nm R&D and fab construction. TSMC’s 5/4nm and below fabs are expected to run at full capacity through year-end.台积电全面上调5/4nm代工价格
TSMC fully raised 2026 foundry prices for 5/4nm and below processes, with order visibility extending into 2027, leaving open the possibility of consecutive annual price hikes. Samsung followed suit, notifying customers of price adjustments in Q4 2025.台积电产能受限拖累AI芯片供应，三星借机缩小差距
A surge in global AI demand strained TSMC’s production capacity, opening a rare window of opportunity for Samsung Electronics to gain ground in the advanced chip race. Industry executives and analysts warned supply constraints are likely to persist through 2026 despite aggressive expansion plans.博通警示台积电产能瓶颈，关注三星代工的机会
Broadcom flagged TSMC’s capacity constraints, turning attention to whether Samsung’s foundry division would benefit from customer diversification. With big tech customers heavily reliant on a single foundry, Samsung was emerging as an alternative supplier.ASML向imec交付高数值孔径EUV设备，用于2nm以下先导线
ASML delivered an EXE:5200 High-NA EUV lithography system to Belgian chip research lab imec, valued at approximately $400 million, to support the NanoIC sub-2nm pilot line project at imec’s headquarters in Leuven. The tool is expected to be fully qualified by Q4 2026, with a joint ASML–imec High-NA EUV lab in Veldhoven remaining operational to ensure continued R&D activities.英伟达在GTC 2026发布Groq 3处理器与Vera CPU
Nvidia kicked off its GTC 2026 conference in San Jose, unveiling the Groq 3 processor and the Vera CPU, signaling the company’s expansion into domains long dominated by Intel and AMD in the AI data center market. The Vera CPU will be sold as a standalone product rather than merely as a component for AI computers.AMD推出400系列处理器扩充锐龙AI产品线
AMD expanded its Ryzen AI portfolio with the introduction of the Ryzen AI 400 Series and Ryzen AI Pro 400 Series desktop processors for consumers and businesses, which AMD called the “world’s first” for next-gen AI PC applications with support for Copilot+ PC experiences. The Ryzen AI 400 processors were expected to debut in laptops from Dell, HP, Lenovo and other OEMs by March.AMD MI355X瞄准亚洲AI基础设施热潮
AMD’s MI355X chip targets Asia’s AI infrastructure boom, positioning itself as an open-source alternative to Nvidia. The chip aims to capture demand driven by Korea’s AI competition and sovereign compute initiatives.三星5/4nm订单大幅增长
Samsung Foundry’s 5/4nm and below orders saw significant increase alongside TSMC, with Samsung also notifying customers of price adjustments in Q4 2025. The tightening advanced node capacity across both major foundries reflects sustained AI-driven demand.美国众议院外交事务委员会通过《芯片安全法案》（H.R. 3447）
On March 26, the U.S. House Foreign Affairs Committee unanimously passed the CHIPS Security Act (H.R. 3447/S. 1705), marking a key step in moving U.S. advanced technology chip export controls from “license management” to “technology monitoring”. The new requirement shifts advanced process chips subject to export controls from “customs interception” to “end-to-end tracking”.美国进一步收紧对华AI芯片出口管制
On March 8, the U.S. further tightened export controls on advanced AI chips and computing equipment to China, imposing special restrictions on the country beyond global licensing rules. Multiple high-performance AI chips were brought under strict licensing management, while higher-performance products remained subject to full embargo. Review procedures, though adjusted to case-by-case review, maintained a “controlled opening” structure with high tariffs and strict logistics oversight.中国对美启动贸易壁垒调查
On March 27, China’s Ministry of Commerce announced a trade barriers investigation into U.S. practices and measures severely disrupting global production and supply chains, including restricting or prohibiting Chinese products from entering the U.S. market, restricting or prohibiting high-tech product exports to China, and limiting or prohibiting two-way investment in key sectors.2026年全球晶圆代工收入预计增长24.8%
TrendForce forecast 2026 global foundry revenue growth of 24.8%, driven by AI-related main chips and peripheral IC demand. TSMC’s revenue was projected to grow 32%, the largest among foundries. Growth drivers included AI GPUs from Nvidia and AMD, plus custom AI chips from North American CSPs and AI startups including Meta, OpenAI, and Groq entering mass production and shipment.Global Semiconductor Market Forecasts Exceed $1.3 Trillion for 2026 Gartner projected global semiconductor revenue to exceed $1.3 trillion in 2026, exhibiting the highest growth in the last two decades. BNP Paribas Equity Research forecast growth to nearly $917 billion in 2026 (up 18%), approaching $1 trillion by 2027 — ahead of prior expectations of 2030. IDC forecast global semiconductor revenue reaching $1.29 trillion in 2026, up 52.8% year-over-year.
2026年存储器价格预计大幅上涨
Gartner forecast DRAM prices would increase by 125% in 2026, with the storage crisis extending into 2027. IDC projected 2026 DRAM revenue at $418.6 billion (up 177%), while Gartner forecast $174.1 billion (up 138.5%). Gartner analysts noted memory price inflation is deep but not permanent.中芯国际指引收入增速高于行业平均
SMIC provided 2026 guidance, projecting revenue growth above the comparable industry average, with capital expenditures roughly flat compared to 2025, assuming no major changes in the external environment.华虹半导体并购申请获上交所受理
On March 30, Hua Hong Semiconductor received an acceptance notice from the Shanghai Stock Exchange regarding its application for issuing shares to purchase assets and raise matching funds.国内并购动态：锴威特拟收购晶艺半导体
On March 27, Kaiwei Te announced plans to acquire 100% equity of Jingyi Semiconductor through a combination of share issuance and cash payment, while also raising matching funds. The transaction constitutes a significant asset reorganization.