【Monthly Semiconductor Industry News】Apr. 2026

1. MARKET & FINANCIAL

1. Q1 2026 Global Semiconductor Sales Reach $T h e S e mi co n d u c t or I n d u s t ry A ssoc ia t i o n (S I A) ann o u n ce d g l o ba l se mi co n d u c t o rs a l es re a c h e d$ 298.5 billion during the first quarter of 2026, a 25% increase compared to Q4 2025. Global sales were $99.5 bi ll i o n d u r 于 g M a rc h 2026, u p 79.2$ 1 trillion in 2026, with Q1 sales significantly exceeding sales in Q4 2025,” said John Neuffer, SIA president and CEO. Regionally, year-over-year sales in March were up in Asia Pacific/All Other (108.5%), the Americas (83.1%), China (74.8%), Europe (46.5%), and Japan (7.4%).

2. ADVANCED PROCESS & FOUNDRY

2. TSMC Expands 2nm Capacity at “2x Speed” with Five Fabs in Ramp-up
TSMC is accelerating advanced process capacity expansion at “2x speed.” Senior Vice President and Co-COO Hou Yung-ching revealed at the company’s North America Technology Symposium that five 2nm wafer fabs are simultaneously entering ramp-up in 2026 — an unprecedented model of multi-fab new process introduction within a single year. First-year 2nm output is projected to be approximately 45% higher than 3nm production at the same milestone. The next-generation A16 process (integrating backside power delivery technology) continues to progress. In advanced packaging, CoWoS and SoIC 3D packaging technologies are being upgraded, with SoIC time-to-market shortened by 75% and total advanced packaging capacity expected to grow about 80% from 2022 to 2027.

3. Global Foundry Revenue Projected to Grow 24.8% in 2026
TrendForce forecast 2026 global foundry revenue growth of 24.8%, with total value reaching approximately $218.8 billion. TSMC is projected to lead with 32% growth, benefiting from continued AI-related main chip and peripheral IC demand from North American CSPs and AI startups. Mature process supply-demand dynamics have reversed as capacity tightens and cost structures rise. Powerchip Semiconductor Corporation reportedly raised 12-inch driver IC foundry prices by 30%, 12-inch CIS by 20%, and 8-inch driver IC by 15%, while 8-inch power semiconductor foundry prices rose about 10% due to tight supply.

4. SMIC Ranked Third Globally in Foundry Revenue
SMIC remained the third-largest foundry globally, continuing to benefit from localization tailwinds. The company reported Q4 2025 revenue of approximately $24.9 billion, up 4.5% sequentially, driven by increased wafer shipments and a slight ASP increase. In April 2026, SMIC shares rose over 6% on the Hong Kong Stock Exchange as the semiconductor sector led broader gains. Meanwhile, SMIC disclosed plans to issue shares to acquire 49% of SMIC North (Beijing), a joint venture with National Integrated Circuit Industry Investment Fund and other shareholders, in a transaction valued at approximately RMB 40.6 billion. The Shanghai Stock Exchange scheduled a review meeting for May 11, 2026.

3. AI CHIPS & PLATFORMS

5. NVIDIA GTC 2026 Unveils GB300-Enhanced DGX Station
At GTC 2026, NVIDIA introduced an enhanced DGX Station built on the GB300 Grace Blackwell Ultra Desktop Superchip, positioned as the most powerful deskside AI system in NVIDIA’s portfolio. The platform delivers up to 20 petaflops of local compute performance and can run one-trillion-parameter models entirely onsite. Dell also introduced its first GB300-based OEM systems within the Dell AI Factory with NVIDIA portfolio, providing enterprises with validated configurations and integrated data pipeline capabilities. NVIDIA founder and CEO Jensen Huang, in a podcast interview, publicly pushed back against U.S. chip export controls on China, stating “chips are not enriched uranium” and arguing that over-restriction would not curb China’s tech development but would drive up global AI industry costs and slow global technological progress.

6. Nvidia’s Rubin Platform Faces HBM4 Validation Delays
NVIDIA’s Rubin platform encountered delays as key components have yet to be fully optimized. TrendForce noted that Rubin’s share of NVIDIA’s high-end GPU shipments is expected to slip from 29% to 22% in 2026. The platform still faces hurdles including a shift in network interconnects. NVIDIA has set a target for HBM4 data processing speeds at around 11Gbps — well above current industry standards.

4. MEMORY & STORAGE

7. HBM Market 2026 Size Revised Up to $62.9 B i ll i o n,$ up 58% year-over-year, but MIC senior industry analyst Yang Kexin revised the figure upward to $62.9 billion, representing 82% growth due to strong demand and intense competition. HBM remains the most structurally supported memory category, driving capacity, materials, packaging, and test resource allocation.

8. Samsung Secures HBM4 Validation from NVIDIA, Gaining Edge
TrendForce reported that Samsung is pushing to lift 1c DRAM yields for HBM4 toward 80%, aiming to reach near-mature levels in the second half of 2026 to strengthen its ability to serve key AI customers including NVIDIA. Despite current yields still estimated below 60%, Samsung successfully passed final quality tests for HBM4 at NVIDIA and AMD, with supply expected to begin in June 2026. Samsung had already started mass production and shipments of the industry’s first HBM4 chips for NVIDIA’s Vera Rubin platform. The company expects HBM revenue to more than triple year-over-year in 2026. In April, Samsung also announced it would stop accepting new orders for LPDDR4 and LPDDR4X mobile memory starting April 17, shifting capacity toward higher-margin LPDDR5/5X and HBM.

9. SK Hynix Cuts HBM4 Shipment Outlook by 20-30% Amid Rubin Delays
SK Hynix is set to reduce HBM4 volumes this year by 20-30% from its original target as NVIDIA’s Rubin rollout is delayed. ZDNet reported the reduced HBM4 volumes are expected to be offset by increased demand for prior-generation HBM3E and server DRAM. Despite the cut, SK hynix continues to dominate the HBM market with approximately 50% market share. The company is channeling its estimated 40 trillion won ($29 billion) 2026 capital expenditure into advanced packaging and custom HBM design, prioritizing alignment with NVIDIA’s roadmap.

10. Samsung Q1 Operating Profit Hits 57.2 Trillion Won, Surpassing 2025 Total
Samsung Electronics reported record Q1 2026 operating profit of 57.2 trillion won ($42 billion), exceeding its full-year 2025 total, driven by successful capacity conversion from traditional chips to high-margin AI accelerator chips. Samsung is morphing into an AI foundry alongside SK Hynix, moving beyond standardized memory production to deliver tightly integrated, tailor-made HBM solutions co-designed with Big Tech architectures. Samsung plans to invest approximately 40.9 trillion won in its Device Solutions division this year, aiming to more than triple custom HBM capacity.

11. South Korean Customs Data Shows Storage Prices Surging
South Korean customs data covering April 2026 to May 10 revealed a monthly surge in storage prices: SSDs soared 63% and HBM increased by 19%, with year-over-year increases for major categories generally ranging between 165% and 500%, underscoring the severity of the ongoing memory super-cycle.

5. GEOPOLITICS & TRADE

12. U.S. House Committee Passes MATCH Act Targeting Semiconductor Exports to China
On April 22, the U.S. House Foreign Affairs Committee passed the Hardware Technology Control Multilateral Coordination Act (MATCH Act) along with multiple other export control bills. The legislation would restrict more equipment exports to China, including comprehensive restrictions on DUV lithography exports from Dutch firm ASML. China’s Ministry of Commerce responded that it “firmly opposes any act that overstretches the concept of national security and abuses export controls,” warning that the act would seriously disrupt global semiconductor supply chain stability. China stated it would closely monitor the legislative process, assess impacts on its interests, and take necessary measures to protect Chinese companies’ rights.

13. U.S. Commerce Department Orders Partial Equipment Shipment Suspension to Hua Hong
The U.S. Commerce Department sent letters to at least several companies, including Lam Research, Applied Materials, and KLA Corporation, ordering them to halt shipments of certain equipment to two Hua Hong (Shanghai Huali Microelectronics) fabs. U.S. officials believe these fabs may be producing China’s most advanced chips. Hua Hong’s subsidiary Huali Microelectronics is reportedly advancing 7nm process R&D and deployment at its Shanghai facility. The restrictions could potentially cause billions of dollars in lost sales for global equipment suppliers, including U.S. firms. SMIC remains China’s only foundry capable of mass-producing 7nm technology.

14. NVIDIA CEO Jensen Huang Publicly Opposes Chip Export Restrictions
NVIDIA CEO Jensen Huang, in a recent podcast interview, publicly pushed back against U.S. chip export controls on China, stating “chips are not enriched uranium — why can’t we sell them to China?” He argued that over-restriction would not curb China’s tech development but would drive up global AI industry costs and slow global technological progress. He noted that China already has ample energy, chip reserves, and top-tier AI research talent, making simple containment ineffective.

6. SUPPLY CHAIN & MANUFACTURING

15. Intel Strengthens AI Collaboration with Google, Secures Samsung Executive
Intel announced a deepened partnership with Google on April 9, focusing on large-scale coordination of AI accelerator systems. Additionally, Intel secured a major hire from Samsung: Shawn Han, a 30-year veteran of Samsung’s foundry division who most recently served as head of foundry sales, will join Intel as Senior Vice President and General Manager of Intel Foundry Services (IFS), effective May 2026, reporting to Executive Vice President Naga Chandrasekaran.

16. Intel Unveils 288MB On-Chip Cache for Nova Lake-S to Compete with AMD 3D V-Cache
Intel introduced a bLLC (big Last Level Cache) planar cache solution for its next-generation Nova Lake-S desktop processors (Core Ultra 400 series), offering up to 288MB cache capacity — 80MB more than comparable AMD products — designed to reduce latency and compensate for Intel’s gaming performance gaps. The Core Ultra 400 series is planned to include at least 13 models, and the x86 desktop processor market is expected to see peak cache competition reshaping industry dynamics in 2026.

17. AMD Expands Cooperation with Samsung to Diversify Manufacturing Sources
AMD and Samsung expanded their partnership with a memorandum of understanding, signaling AMD’s desire to diversify beyond exclusive reliance on a single foundry for next-generation AI chips.

7. M&A AND CAPITAL MARKETS

18. China Regulators Set May 11 Review Date for SMIC’s RMB 40.6B Acquisition of SMIC North
The Shanghai Stock Exchange’s M&A Committee scheduled a review for May 11, 2026, regarding SMIC’s issuance of shares to acquire the remaining 49% equity of SMIC North (Beijing). The approximately RMB 40.6 billion transaction involves issuance to five shareholders including the National Integrated Circuit Industry Investment Fund. SMIC completed its revised merger filing in April.

19. China Foundry Hua Hong Semiconductor Leads Sector Gains on Stock Exchange
Hua Hong Semiconductor shares surged in April, rising over 6% on April 27 as the semiconductor sector led Hong Kong market gains. Hua Hong Group (including HHGrace and HLMC) ranked sixth among global foundries in 2025, with Q4 revenue of approximately $1.22 billion. Analyst downgrade forecasts at the time suggested potential 3% sales reductions.

20. Dongwei Semiconductor Acquires Controlling Stake in Huitai for RMB 408 Million
China-based Dongwei Semiconductor (688261) acquired 53.0921% equity of Shenzhen Huitai Semiconductor Technology for RMB 408 million in cash, gaining controlling interest and consolidating Huitai into its financial statements. The acquisition was approved at a general meeting on April 9, 2026.

21. Hycore (Huarong Yuanchuang) Acquires 39% Stake in Wuhan Pusai for RMB 206 Million
Hycore (688001), the first company listed on China’s STAR Market, announced plans to acquire 39% equity of Wuhan Pusai Electronics Co., Ltd. for RMB 206.16 million in cash, increasing its stake from 12% to 51% to gain controlling interest and consolidate the company. Pusai specializes in test instruments and equipment for optoelectronics and power semiconductors. The deal includes a performance guarantee requiring Pusai’s non-GAAP net profit to reach at least RMB 40 million in 2026.

22. Sanan Optoelectronics Terminates $S anan Opt oe l ec t ro ni cs t er mina t e d i t s p ro p ose d$ 239 million acquisition of Lumileds Holding B.V.’s 100% equity after the U.S. Committee on Foreign Investment in the United States (CFIUS) determined the transaction posed “unresolvable U.S. national security risks.” Sanan stated the termination would not affect its normal operations and that it remains committed to its internationalization strategy in the mid-to-high-end LED sector.

8. TECH TRENDS & PEOPLE

23. SiFive Raises $R I SC - V I P co m p an y S i F i v er ai se d$ 400 million on April 9, 2026, to expand its high-performance RISC-V roadmap for data center applications, reflecting growing industry momentum behind RISC-V architecture.

24. OpenAI Reportedly Developing Smartphone with MediaTek, Qualcomm, and Luxshare
TF International Securities analyst Ming-Chi Kuo reported on April 27 that OpenAI plans to develop its own smartphone, collaborating with MediaTek and Qualcomm on the application processor, with Luxshare Precision serving as the exclusive system co-design and manufacturing partner. Mass production is expected by 2028. Qualcomm shares rose more than 10% following the report.

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