Features
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Features
| Applications
|
Absolute Maximum Ratings
| Parameter | Symbol | Min. | Max. | Unit |
| Vin,EN,Voltage | VIN | -0.3 | 60 | V |
| Storage Temperature Range | TSTG | -55 | 150 | ℃ |
| Operating Temperature Range | -40 | 85 | ℃ | |
| BS Voltage | VBS | VSW-0.3 | VSW+5V | V |
| FB Voltages | VFB | -0.3 | 6.0 | W |
| Lead Temperature(Soldering,10s) | 260 | ℃ | ||
| SW Voltage | VSW | -0.3 | VIN+0.5 | V |
| Thermal Resistance | θJA | 160 | ℃/W | |
| Thermal Resistance | θJC | 130 | ℃/W |
Note 1: Exceeding these ratings may damage the device.
Note 2: The device is not guaranteed to function outside of its operating conditions
Electrical Characteristics
VIN=12V,Tamb= 25℃,unless specified otherwise.
| Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit |
| Input Voltage Range | VIN | — | 4.5 | — | 60 | V |
| Supply Current (Quiescent) | Iq | VFB=1.0V, VEN =5.0V | — | 0.7 | — | mA |
| Supply Current (Shutdown) | Is | VEN =0 or EN = GND | — | — | 1 | μA |
| Feedback Voltage | V | — | — | 0.795 | — | V |
| Switch On-Resistance | — | 900 | mΩ | |||
| Upper Switch Current Limit | — | — | 0.95 | — | A | |
| Switching Frequency | — | 2 | — | MHz | ||
| Maximum Duty Cycle | VFB=90% | — | 98 | — | % | |
| Minimum On-Time | Ton min | 100 | nS | |||
| EN Rising Threshold | Venr | 3.8 | — | — | V | |
| EN Falling Threshold | Venf | — | — | 0.6 | V | |
| Under-Voltage Lockout Threshold | Wake up VIN Voltage | — | — | 4.8 | V | |
| Shutdown VIN Voltage | 3.7 | — | — | V | ||
| Soft Start | — | 2.4 | — | mS | ||
| Thermal Shutdown | Tsd | 160 | ℃ | |||
| Thermal Hysteresis | Thys | 30 | ℃ |
Note (1): MOSFET on-resistance specifications are guaranteed by correlation to wafer level measurements.
Note (2): Thermal shutdown specifications are guaranteed by correlation to the design and characteristics analysis.
Order Information
| Part No | Package | Manner of Packing | Devices per bag/reel |
| SSP9458 | SOT23-6 | Reel | 3000 |
Shanghai Siproin
Microelectronics Co.,Ltd.
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