Features
| Application
|
Blog
Features
| Application
|
Absolute Maximum Ratings
Parameter | Symbol | Ratings | Units |
Supply Voltage | VIN | -0.3~8.5 | V |
Output Current | IOUT | 1.1 | A |
Operating Temperature | Topr | -40~+85 | ℃ |
Storage Temperature | Tstg | -40~+125 | ℃ |
Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute Maximum Ratings” may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
Electrical Characteristics
H7606 for any output voltage(Ta=25℃)
Parameter | Symbol | Conditions | Min. | Typ. | Max. | Unit |
Output Voltage | Vout | Vin=Vout+1V 1.0mA≤Iout≤30mA | Vout×0.98 | — | Vout×1.02 | V |
Output Current | Iout | Vin-Vout=1V | — | 1000 | — | mA |
Low dropout | Vdrop | Refer to the next table | ||||
Line Regulation | ![]() | 1.6V≤Vin≤8V Iout=100mA | — | 0.05 | 0.2 | %/V |
Load Regulation | △Vout | Vin= Vout+1V 1.0mA≤Iout≤100mA | — | 12 | 30 | mV |
Output voltage Temperature Coefficiency | ![]() | Iout=30mA 0℃≤Ta≤70℃ | — | ±100 | — | Ppm/℃ |
Supply Current | Iss1 | — | — | 2.0 | 5.0 | μA |
Input Voltage | Vin | — | — | — | 8.5 | V |
Thermal shutdown detection temperature | TSD | Junction temperature | – | 160 | – | ℃ |
Thermal shutdown release temperature | TSR | Junction temperature | – | 140 | – | ℃ |
Order information
Product model | Package | Manner of packing | Minimum packing quantity |
H7651-XXPX | SOT89 | Reel | 1000 |
H7651-XXGX | SOT223 | Reel | 3000 |
H7651-①②③④
Designator | Symbol | Description |
② | Integer | Output Voltage(1.2V~5.0V) |
③ | P | Package:SOT89 |
G | Package:SOT223 | |
④ | R | RoHS / Pb Free |
G | Halogen Free |
Shanghai Siproin
Microelectronics Co.,Ltd.
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