{"id":2961,"date":"2025-09-30T10:48:00","date_gmt":"2025-09-30T02:48:00","guid":{"rendered":"https:\/\/www.siproin-ic.com\/%e3%80%90monthly-semiconductor-industry-news%e3%80%91aug-2025-copy\/"},"modified":"2025-10-10T11:02:14","modified_gmt":"2025-10-10T03:02:14","slug":"%e3%80%90monthly-semiconductor-industry-news%e3%80%91sep-2025","status":"publish","type":"post","link":"https:\/\/www.siproin-ic.com\/ko\/%e3%80%90monthly-semiconductor-industry-news%e3%80%91sep-2025\/","title":{"rendered":"\uc6d4\uac04 \ubc18\ub3c4\uccb4 \uc0b0\uc5c5 \ub274\uc2a4] 2025\ub144 9\uc6d4\ud638"},"content":{"rendered":"

1.\u00a0Synopsys Expands GenAI for Chip Design with Copilot (September 2)<\/strong><\/h3>\n
Synopsys announced major updates to its\u00a0Synopsys.ai Copilot<\/strong>, integrating generative AI across the chip design workflow. Early access results showed up to\u00a035% productivity gains<\/strong>\u00a0for junior engineers and\u00a010x\u201320x faster script generation<\/strong>. The tool now supports automated RTL and formal assertion generation, streamlining critical design and verification tasks from hours to minutes\u00a0Synopsys<\/span>.<\/div>\n

2.\u00a0Wolfspeed Launches 200mm SiC Materials for Mass Production (September 11)<\/strong><\/h3>\n
Wolfspeed announced the commercial availability of its\u00a0200mm silicon carbide (SiC) materials<\/strong>, enabling large-scale adoption of wide-bandgap semiconductors for electric vehicles (EVs) and energy infrastructure. The move solidifies Wolfspeed\u2019s position as a leader in SiC technology, leveraging its newly expanded 200mm manufacturing capacity .<\/div>\n

3.\u00a0US Adds 23 Chinese Entities to Entity List, Including 13 Semiconductor Firms (September 12)<\/strong><\/h3>\n
The U.S. Department of Commerce placed\u00a013 Chinese semiconductor companies<\/strong>\u00a0(e.g., Hygon) on the Entity List, restricting their access to U.S. EDA tools and manufacturing equipment. This impacts advanced-node chip design (e.g., 7nm) and forces shifts to domestic alternatives like Hua Da \u4e5d\u5929\u2019s Argus DRC tools, which cover only\u00a060% of 7nm rules<\/strong>\u00a0.<\/div>\n

4.\u00a0ASML\u2019s High-NA EUV Orders Double (September 25)<\/strong><\/h3>\n
Intel doubled its order for ASML\u2019s\u00a0High-NA EUV lithography systems<\/strong>\u00a0to two units, targeting its\u00a014A process node<\/strong>\u00a0(planned for 2028). The move underscores Intel\u2019s push to regain leadership in advanced manufacturing, though challenges remain in mastering EUV and securing external clients .<\/div>\n

5.\u00a0TSMC\u2019s 3nm and 5nm Capacity Reaches Near 100% Utilization (September 27)<\/strong><\/h3>\n
TSMC reported\u00a0full capacity bookings<\/strong>\u00a0for its 3nm and 5nm nodes through early 2026, driven by demand from Apple, NVIDIA, and AMD. The 3nm process, used in NVIDIA\u2019s Rubin GPU and AMD\u2019s MI355X, is a key revenue driver, while advanced packaging (e.g., CoWoS) is expanding to meet AI chip demand .<\/div>\n

6.\u00a0Samsung Cuts 2nm Wafer Prices by 33% to Challenge TSMC (September 29)<\/strong><\/h3>\n
Samsung began offering **2nm wafers at $20,000 per unit**, 33% cheaper than TSMC\u2019s $30,000, in a bid to attract clients like NVIDIA and Qualcomm. The company aims to diversify its customer base and improve \u826f\u7387 after exclusively using the node for its own mobile processors .<\/div>\n

7.\u00a0AMD Unveils Fifth-Generation EPYC Processors at Alibaba Cloud Summit (September 24\u201326)<\/strong><\/h3>\n
AMD launched its\u00a0EPYC Turin processors<\/strong>\u00a0(3nm\/4nm hybrid process) at the Alibaba Cloud Summit, featuring\u00a0Zen 5 architecture<\/strong>\u00a0with 17% higher IPC and native AVX512 support. The chips target AI workloads and cloud computing, complementing AMD\u2019s ROCm software ecosystem for generative AI .<\/div>\n

8.\u00a0South Korea\u2019s Semiconductor Exports Hit Record $16.61B in September (September 30)<\/strong><\/h3>\n
South Korea\u2019s semiconductor exports rose\u00a022% YoY<\/strong>\u00a0to $16.61B, driven by HBM and DDR5 demand. The country\u2019s total exports reached a\u00a03.5-year high<\/strong>\u00a0of $65.95B, with semiconductors and EVs as key growth drivers .<\/div>\n

9.\u00a0Europe Unveils Semiconductor Coalition to Boost Competitiveness (September 30)<\/strong><\/h3>\n
\uadf8\ub9ac\uace0\u00a0Semiconductor Coalition Europe<\/strong>\u00a0(backed by 70+ companies) called for a revised EU Chips Act to enhance regional R&D and manufacturing. The initiative aims to align policy with market needs and secure Europe\u2019s position in advanced packaging and sustainable semiconductor production .<\/div>\n

10.\u00a0GaN Technology Advances with New Partnerships and Products (September 23\u201330)<\/strong><\/h3>\n
    \n
  • ROHM launched a 2-in-1 SiC module<\/strong>\u00a0(\u201cDOT-247\u201d) for high-power applications, offering\u00a0higher power density<\/strong>\u00a0and design flexibility .<\/li>\n
  • Nexchip, Union Electronics, and Innoscience<\/strong>\u00a0partnered to develop\u00a0intelligent integrated GaN solutions<\/strong>\u00a0for EVs, targeting improved system efficiency and cost reduction .<\/li>\n
  • GaNext<\/strong>\u00a0debuted its\u00a0Gen3 GaN platform<\/strong>\u00a0at PCIM Asia, featuring a\u00a09m\u03a9 650V FET<\/strong>\u00a0(world\u2019s lowest Rds(on)) for EV charging and energy storage .<\/li>\n<\/ul>\n

    11.\u00a0E&R Engineering Expands North American Presence (September 24)<\/strong><\/h3>\n
    Taiwan-based E&R Engineering established a U.S. subsidiary in Arizona to support\u00a0laser and plasma equipment<\/strong>\u00a0demand from North American clients. The company plans to open demo labs in Phoenix and Portland by 2026, targeting EV and AI chipmakers .<\/div>\n

    12.\u00a0Intel\u2019s Panther Lake CPU to Enter Mass Production (September 24)<\/strong><\/h3>\n
    Intel announced\u00a0volume production<\/strong>\u00a0of its Panther Lake CPUs based on the\u00a0Intel 18A process<\/strong>, its first 20A-class node. The chips will power next-gen client and server products, leveraging RibbonFET and PowerVia technologies.<\/div>\n

    13.\u00a0US-China Tech Tensions Persist (September 3)<\/strong><\/h3>\n
    Despite earlier reports of NVIDIA\u2019s H20 export license approval, the U.S. Bureau of Industry and Security (BIS) delayed processing\u00a0thousands of export licenses<\/strong>, including H20 chips to China. This impacts\u00a0$10B+ in orders<\/strong> and raises uncertainty for AI infrastructure projects.<\/div>","protected":false},"excerpt":{"rendered":"

    Despite earlier reports of NVIDIA\u2019s H20 export license approval, the U.S. Bureau of Industry and Security (BIS) delayed processing\u00a0thousands of export licenses, including H20 chips to China. This impacts\u00a0$10B+ in orders and raises uncertainty for AI infrastructure projects.<\/p>","protected":false},"author":8,"featured_media":2962,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":[],"categories":[36],"tags":[317,282],"acf":[],"_links":{"self":[{"href":"https:\/\/www.siproin-ic.com\/ko\/wp-json\/wp\/v2\/posts\/2961"}],"collection":[{"href":"https:\/\/www.siproin-ic.com\/ko\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.siproin-ic.com\/ko\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.siproin-ic.com\/ko\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/www.siproin-ic.com\/ko\/wp-json\/wp\/v2\/comments?post=2961"}],"version-history":[{"count":0,"href":"https:\/\/www.siproin-ic.com\/ko\/wp-json\/wp\/v2\/posts\/2961\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.siproin-ic.com\/ko\/wp-json\/wp\/v2\/media\/2962"}],"wp:attachment":[{"href":"https:\/\/www.siproin-ic.com\/ko\/wp-json\/wp\/v2\/media?parent=2961"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.siproin-ic.com\/ko\/wp-json\/wp\/v2\/categories?post=2961"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.siproin-ic.com\/ko\/wp-json\/wp\/v2\/tags?post=2961"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}