{"id":3042,"date":"2025-12-31T10:18:51","date_gmt":"2025-12-31T02:18:51","guid":{"rendered":"https:\/\/www.siproin-ic.com\/monthly-semiconductor-industry-news-dec-2025-copy\/"},"modified":"2026-01-06T10:29:28","modified_gmt":"2026-01-06T02:29:28","slug":"monthly-semiconductor-industry-news-dec-2025","status":"publish","type":"post","link":"https:\/\/www.siproin-ic.com\/fr\/monthly-semiconductor-industry-news-dec-2025\/","title":{"rendered":"\u3010Monthly Semiconductor Industry News\u3011Dec. 2025"},"content":{"rendered":"
    \n
  1. \n
      \n
    1. \n

      TSMC Announces Site Selection and Investment Plan for 1nm-Class Fabs<\/strong>
      \nTSMC officially announced plans to build its most advanced 1nm-generation (A10) wafer fabs in Taiwan’s Taoyuan and Kaohsiung science parks. The total investment is expected to exceed $30 billion, with construction slated to begin in mid-2026.<\/p>\n<\/li>\n

    2. \n

      U.S. and Japan Sign Bilateral Advanced Packaging Cooperation Agreement<\/strong>
      \nThe U.S. and Japanese governments signed a memorandum to jointly fund R&D in next-generation chip packaging technologies, focusing on hybrid bonding, silicon photonics integration, and chiplet standards.<\/p>\n<\/li>\n

    3. \n

      Micron Commences Mass Production of 1-beta DRAM with Backside Power Delivery<\/strong>
      \nMicron started volume production of its next-generation DRAM chips using industry-first backside power delivery network technology, improving energy efficiency by 25% for data center and AI applications.<\/p>\n<\/li>\n

    4. \n

      China Grants Major VAT Rebates to Domestic Semiconductor Equipment Manufacturers<\/strong>
      \nTo accelerate import substitution, Chinese authorities announced a three-year, full value-added tax refund policy for domestic purchases of key semiconductor manufacturing equipment, covering etching, deposition, and inspection tools.<\/p>\n<\/li>\n

    5. \n

      Apple Unveils In-House AI Server Chip “Athena M3”<\/strong>
      \nApple announced its proprietary data center AI accelerator chip, Athena M3, designed to power its expanding Apple Intelligence cloud services. It features a unified memory architecture and is produced using TSMC’s 2nm process.<\/p>\n<\/li>\n

    6. \n

      Qualcomm Acquires Major Automotive Chip Designer for $4.2 Billion<\/strong>
      \nQualcomm completed the acquisition of a leading European automotive System-on-Chip (SoC) design company, aiming to strengthen its Snapdragon Digital Chassis platform for software-defined vehicles.<\/p>\n<\/li>\n

    7. \n

      IBM and Rapidus Demonstrate Functional 2nm Prototype Chip<\/strong>
      \nIBM and Japan’s Rapidus consortium successfully demonstrated a fully functional 2nm test chip, validating Rapidus’s high-volume manufacturing capabilities and marking a key milestone for Japan’s semiconductor revival plan.<\/p>\n<\/li>\n

    8. \n

      Global Semiconductor Sales Report Shows First Quarterly Decline in Two Years<\/strong>**
      \nThe Semiconductor Industry Association (SIA) reported a 3.5% quarter-over-quarter decline in global sales for Q4 2025, attributed to inventory adjustments in the consumer electronics and traditional PC segments.<\/p>\n<\/li>\n

    9. \n

      South Korea Announces $15 Billion “K-Chips” R&D Fund for Post-HBM4 Era<\/strong>
      \nThe South Korean government launched a new strategic fund focused on memory technologies beyond HBM, such as processing-in-memory (PIM), neuromorphic chips, and carbon nanotube-based DRAM.<\/p>\n<\/li>\n

    10. \n

      SEMI Issues Warning on Potential Noble Gas Supply Shortage<\/strong>
      \nIndustry association SEMI alerted its members about potential supply chain risks for neon and krypton gases in 2026, urging diversification beyond traditional sources in light of ongoing geopolitical tensions.<\/p>\n<\/li>\n<\/ol>\n

      These developments highlight the industry’s focus on next-generation process nodes, geopolitical collaboration, supply chain resilience, and diversification into AI and automotive sectors, even as market cyclicality begins to re-emerge.<\/p>\n<\/li>\n<\/ol>","protected":false},"excerpt":{"rendered":"

      These developments highlight the industry’s focus on next-generation process nodes, geopolitical collaboration, supply chain resilience, and diversification into AI and automotive sectors, even as market cyclicality begins to re-emerge.<\/p>","protected":false},"author":9,"featured_media":3044,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":[],"categories":[36],"tags":[317,282],"acf":[],"_links":{"self":[{"href":"https:\/\/www.siproin-ic.com\/fr\/wp-json\/wp\/v2\/posts\/3042"}],"collection":[{"href":"https:\/\/www.siproin-ic.com\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.siproin-ic.com\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.siproin-ic.com\/fr\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/www.siproin-ic.com\/fr\/wp-json\/wp\/v2\/comments?post=3042"}],"version-history":[{"count":0,"href":"https:\/\/www.siproin-ic.com\/fr\/wp-json\/wp\/v2\/posts\/3042\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.siproin-ic.com\/fr\/wp-json\/wp\/v2\/media\/3044"}],"wp:attachment":[{"href":"https:\/\/www.siproin-ic.com\/fr\/wp-json\/wp\/v2\/media?parent=3042"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.siproin-ic.com\/fr\/wp-json\/wp\/v2\/categories?post=3042"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.siproin-ic.com\/fr\/wp-json\/wp\/v2\/tags?post=3042"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}