Escalation of U.S. Semiconductor Export Controls on China: In early October, the U.S. Bureau of Industry and Security announced further restrictions on the export of specific manufacturing equipment and EDA software used for producing advanced-node chips to China, aiming to slow China’s progress in N+2 and more advanced process technologies.
ASML Delivers First Next-Generation High-NA EUV Lithography Machine: ASML formally delivered the first Twinscan EXE: 5200 lithography system to a leading customer. This High-Numerical Aperture EUV tool is critical for achieving future 1nm and sub-1nm chip processes.
Intel Announces Successful Intel 18A Test Chip Tape-Out: Intel announced that its Intel 18A (roughly 1.8nm equivalent) process node, key to regaining technology leadership, has successfully taped out test chips for a major customer, with mass production expected in early 2026.
Global Semiconductor Equipment Spending Projected to Hit New Record: In its latest quarterly forecast, SEMI stated that despite macroeconomic uncertainties, driven by demand for AI, HPC, and automotive chips, total global fab equipment investment is expected to surpass $120 billion in 2025, a 9% year-on-year increase.
SK Hynix Begins Sampling Foundational Chips for Next-Gen HBM4: SK Hynix has started producing samples of the base chips for its next-generation HBM4 memory. HBM4, expected to launch in 2026, will feature major innovations in stacking, bandwidth, and the integration of logic cores.
TSMC’s Second Japan Fab Construction Officially Begins: JASM, a joint venture between TSMC, Sony, Denso, and other Japanese firms, began construction on its second wafer fab in Kumamoto. Focusing on 6/7nm and 12/16nm processes, it is scheduled to begin production in 2027 to meet strong demand from Japan’s automotive and consumer electronics industries.
First Major Funding Under EU Chips Act Approved: The European Commission approved the first Major Project under the European Chips Act, with total aid exceeding €22 billion, to build semiconductor value chains from R&D to large-scale production in Germany, France, Italy, and Poland.
Price Wars Emerge in AI PC Chips: To compete for the booming AI PC market, new generation AI PC processors launched in October by Qualcomm, Intel, and AMD are offering increasingly competitive pricing while maintaining performance improvements, signaling intensifying competition in this segment.
China’s Continued Mature Process Capacity Expansion Draws Global Attention: A TrendForce report indicates that China’s share of global capacity for 28nm and older mature processes continues to grow, projected to reach about 35% by the end of 2025, raising concerns among manufacturers in other regions about potential oversupply and price competition.
Breakthrough in Semiconductor Materials Innovation: Applied Materials and Tokyo Electron each announced breakthroughs in new interconnect materials (e.g., Ruthenium, Molybdenum) and low-k dielectric materials, which are crucial for addressing the challenges of sharply increasing resistance and capacitance at sub-2nm process nodes.
